Die Attach Material
Shin-Etsu die attach materials come in two types : epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. It has excellent releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treated like thermal curing. It shows very low stress after curing.
![](https://www.shinetsu.co.jp/wp-content/uploads/2019/03/11-ダイアタッチ材 Die_Attach_Material.jpg)
Applications
Site URL
![](/wp-content/themes/shinetsu/images/qa-icon.png)
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Company:Shin-Etsu Chemical Co., Ltd.
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Department:Organic Hybrid Materials Division
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Phone:+81-3-6812-2426