Equipment to inspect/judge bumps on the wafer automatically.
By transmitting X-rays through voids (air bubbles) inside the wafer, the void diameter (area) is calculated from a transmitted image to automatically judge whether to accept voids exceeding standards.
It uses a microfocus X-ray tube as an X-ray source, and a cutting-edge X-ray digital camera for the X-ray image receiving section, to extract high-resolution images and enable high-precision void inspection.