X-ray bump/void inspection equipment
(X-ray inspection equipment, bump inspection equipment, X-ray observation equipment, solder inspection equipment)
Equipment to inspect/judge bumps on the wafer automatically.
By transmitting X-rays through voids (air bubbles) inside the wafer, the void diameter (area) is calculated from a transmitted image to automatically judge whether to accept voids exceeding standards.
It uses a microfocus X-ray tube as an X-ray source, and a cutting-edge X-ray digital camera for the X-ray image receiving section, to extract high-resolution images and enable high-precision void inspection.
![](https://www.shinetsu.co.jp/wp-content/uploads/2020/02/X線バンプボイド検査装置.jpg)
Series Name
Applications
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Company:Shin-Etsu Engineering Co., LTD.
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Department:Electro-Mechanics Division
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Email:systeminfo@see.jp