Bump Voids X-ray Inspector

This automatic X-ray inspection equipment automatically inspects and judges bumps on wafers.
It shoots transmission images of voids (bubbles) in bumps using an X-ray, calculates the diameter (area) of voids from these images, thereby automatically judging the acceptance of voids with a value exceeding the standard. It uses a microfocus X-ray tube as an X-ray source and adopts the cutting-edge X-ray digital camera for the X-ray image receiving section to enable extracting high-resolution images, which in turn allows for a high-precision inspection of voids.

Applications

  • Inspecting voids in bumps on wafers
For Inquiries About This Product
  • Company:
    Shin-Etsu Engineering Co., Ltd.
  • Department:
    Electro-Mechanics Sales &Marketing Department
  • Phone:
    +81-27-384-5720