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  • Silicones(Fluid, Resin, Rubber, etc.)
  • Polyvinyl chloride (PVC resin)
  • Semiconductor silicon(Silicon wafers)
  • Epoxy molding compounds
  • Cellulose derivatives
  • Rare earths
  • Rare earth magnets
  • POVAL
  • Synthetic quartz
  • Methanol
  • Oxide single crystals
  • Chloromethane
  • Photoresists
  • Caustic soda
  • Photosensitive adhesive for 3D-package
  • Liquid Fluoroelastomers (SHIN-ETSU SIFEL^™)
  • Fluorinated Anti-smudge Coating Agents (SHIN-ETSU SUBELYN^™)
  • Micro LED Transfer Process
  • “Shin-Etsu Dual Damascene Process“ to manufacture Advanced IC package substrates
  • Micro device Transfer Process
  • Silicon Metal
  • Other products
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