Wafer vacuum assembling equipment

Equipment to align and bond two wafer-size sheet substrates in vacuum with high precision. It can be used for device manufacturing processes for micro displays, or various sensors including LCOS and CMOS.
It can handle wafers of φ200 mm to φ300 mm, and achieve high-precision alignment with repeatability of 0.2 [um] or less in vacuum, thanks to unique panel chucking, precision alignment, and image processing mechanisms.
This equipment has a track record of being used for many micro device manufacturing processes. We can also offer an integrated line consisting of this equipment as well as peripheral devices, etc.