Shin-Etsu Polymer’s packaging and carrier materials are designed to ptotect silicon wafers and devices from particle contamination during transportation. Our packaging materials are comprehensively designed using the right combination of material selection, precision compound, and analysis technologies. Technological strengths include evaluation technologies such as material engineering and wafer investigation, clean environment control, precision molding and design that precisely meet evolving customer requirements.
Company:Shin-Etsu Polymer Co., Ltd.
Department:Sales Unit Sales & Marketing Division Ⅲ