Epoxy Encapsulant Material

(Epoxy molding compound (EMC))

Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials that use a transfer molding system for various electronic parts. They are developed with the advanced technology cultivated through the development of silicone. They have low stress, low warpage and high thermal conductivity characteristics.

Shin-Etsu supplies not only general surface mounting, but also highly reliable encapsulation materials for large automotive power modules and various sensors.

Series Name

  • KMC series


  • Automotive parts
  • Semiconductor devices
  • Semiconductor wafers
  • Electronic components
  • Heat-resistant components
For Inquiries About This Product
  • Company:
    Shin-Etsu Chemical Co., Ltd.
  • Department:
    Electronics Materials Division, Organic Electronics Materials Dept.
  • Phone: