Liquid Epoxy Encapsulant Material

Shin-Etsu Chemical liquid epoxy encapsulating material (SMC series) is a one component type liquid epoxy material which developed from semiconductor devices, especially for underfill applications.
Semiconductor devices molded by “SMC” have excellent electrical characteristics and moisture resistance. In addition, it has shown outstanding stress reduction by using specific technique of silicone.

Series Name

  • SMC series

Applications

  • Automotive parts
  • Semiconductor devices
  • Semiconductor wafers
  • Smartphones
  • Wearable devices
  • Electronic components
  • Heat-resistant components
For Inquiries About This Product
  • Company:
    Shin-Etsu Chemical Co., Ltd.
  • Department:
    Electronics Materials Division, Organic Electronics Materials Dept.
  • Phone:
    +81-3-3246-5231