Shin-Etsu Chemical to launch newly developed advanced materials for 5G-related products
Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh) is launching a number of new products in order to take advantage of surging demand for highly advanced materials in the coming 5G era (Fifth Generation Telecommunication).
Shin-Etsu has newly developed a “Quartz Cloth” and a “Thermoset Ultra-low Dielectric Resin” ideal for electronics devices, printed circuit boards, IC substrates, antennas, and radar domes that will be used in 5G high-frequency (including millimeter-wave) communication. Furthermore, we are expanding our lineup of heat dissipation products.
In connection with these newly developed products, Shin-Etsu concluded a licensing agreement with Novoset, LLC (Head Office: Peapack, New Jersey; CEO Sajal Das) regarding the manufacturing and sales of high-performance thermoset ultra-low dielectric resins that Novoset has developed.
The details of each new 5G-related Shin-Etsu product are as follows:
1) Quartz Cloth (Product name: SQX Series)
It has immensely superior characteristics concerning transmission loss (degree of degradation of the electrical signal), such as a Dk (dielectric constant) of less than 3.7, a Df (dissipation factor) of less than 0.001, and a linear expansion coefficient of less than 1ppm/°C.
Its low-loss capabilities are most suitable for applications such as a circuit board’s core material to provide key support for next-generation 5G requirements for very high-speed communications materials, and it also demonstrates its vastly superior characteristics for antennas and radar domes’ fiber-reinforced plastic parts material.
The Quartz Cloth consists of very thin quartz threads, whose thickness can be made even under 20μm, and it can match the new demand for thinner laminated circuit boards.
In addition, quartz has the characteristic of having very few occurrences of α-rays and it can prevent the malfunctioning of devices due to radiation rays.
2) Thermoset Ultra-Low Dielectric Resin (Product name: SLK Series)
This product has low dielectric characteristics close to those of fluorocarbon resins as well as high strength and high elasticity. The lowest level dielectric properties with a dielectric constant of less than 2.5 in the high-frequency band (10～80GHz) and a dielectric dissipation factor of less than 0.0025 are achieved by this thermoset resin.
Because it has the properties of low moisture uptake and high adhesive strength to low profile copper (low roughness copper foils) as well, it is suitable for usage in such areas as FCCL (flexible copper clad laminates) and as an adhesive agent.
We are also planning to develop low dielectric encapsulant materials and low dielectric high-thermal conductivity adhesives.
Shin-Etsu has reached a license agreement with Novoset, LLC regarding ultra low-loss dielectric resin with high-temperature resistance and very low moisture absorbency. Adding these products to our product line-up will strengthen our market position in CCL (copper-clad laminates), rigid laminated circuit boards (multilayer IC substrates), antennas and radar domes for communication base stations that require high heat resistance and reliability.
3) Heat Dissipation Sheet (Product name: SAHF Series)
In order to meet increasing market demand for 5G, we have relaunched newly developed sticky sheet products onto the market, sheet that is combined with heat dissipation material and a hot melting adhesive sheet.
Shin-Etsu’s products offer a wide range of thermal conductivity from 5W/mK to 100W/mK, making them very suitable in applications for power semiconductors and automotive fields where high reliability is required.
Shin-Etsu will contribute to the realization and improvement of 5G by developing advanced high-performance materials and meeting the requests of our customers. To lead in this area, we will aggressively pursue the development and introduction of new products and technologies.
- Shin-Etsu Chemical Co., Ltd. Public Relations Dept. Tetsuya Koishikawa
- TEL: 03-3246-5091, or from outside Japan: 81-3-3246-5091
- FAX: 03-3246-5096, or from outside Japan: 81-3-3246-5096