Yellow-green to red AlGaInP LED chips

Shin-Etsu handoutai (SEH) will supply from yellow-green to red LED chip (dice) using AlGaInP-LED. We have a track record of supplying various size, bonding type, and color(wavelength).

We can suppiy 3-type of chips.

1.TS type
This type of design chip has strong lateral light output characteristics and is used for outdoor display and sign. It is possible to use fusion bonding, but we can form trasnparent base layer by growth.This type of chip is hard to peel compared to bonding type chip. This type of chip is suitable for the environments that require high reliability.

2. Metal bonding type
This type of chip has a thin light extraction layer, so lateral light output is minimized.
This type of design chip has strong vertical light output characteristics and is used for outdoor display and automobile exterior.

3.BCB bonding type
In this type of chip, the light-emitting layer is bonded with resin.(The resin is benzocycrobtene(BCB).)
This type of design chip can bond various kinds of wafers (Si, Sapphire, SOI, SOS, etc) and patterned wafers. This type is often used for flip chip and micro LED.

Please contact us if you would like other clasical design chip.
GaP chips (HVPE type) for pilot lamps have a long track record, but there are a wide variety of types, so please contact us for details.



LED chip (dice)

Fusiuon bonding Metal bonding BCB bonding
TS(transparent substrate) type MR/BR(Metal bonding) type for micro LED (prototype)


TS(transparent substrate) type

TS type LED is vertical type chips.This type chip has the transparent material body and have strong lateral light output characteristics. This type chip has two forming methid. One is bonding type and another is growth type. In former method, bottom side transparent layer is formed by fusion bonding. In another method,bottom side transparent layer is formed by HVPE growth. This type dice is suitable for bullet shaped lamp.

Size[mil]
Dominant wavelength[nm]
Up side(type)
Light distrubution
Applicable package
9
590-625
P(bonding)
Wide
Mold type/SMD
10
590-629
P(bonding/growth)
Wide
Mold type/SMD
14
590-625
P(bonding/growth)
Wide
Mold type/SMD

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MR/BR(Metal bonding) type

Metal bonding type LED is vertical type chips. Due to metal reflector, vertical light output is strong.This type dice can apply large size and high power characteristics, and is suitable for SMD (Surface Mount Device).
If you are looking for a size or wavelength that is not listed, please contact us.

Size[mil]
Dominant wavelength[nm]
Up side(type)
Light distrubution
Applicable package
8
590-630
N(Vertical)
On-axis
SMD
9
590-625
N(Vertical)
On-axis
SMD
10
590-625
N(Vertical)
On-axis
SMD
12
590-630
N(Vertical)
On-axis
SMD
14
590-625
N(Vertical)
On-axis
SMD
8
590-625
P(Vertical)
On-axis
SMD
9
590-630
P(Vertical)
On-axis
SMD
10
590-625
P(Vertical)
On-axis
SMD
12
620-625
P(Vertical)
On-axis
SMD
14
590-625
P(Vertical)
On-axis
SMD
20
590-625
P(Vertical)
On-axis
SMD
30
615-625
P(Vertical)
On-axis
SMD
42
615-625
P(Vertical)
On-axis
SMD

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for micro LED

Chips for micro LED have the structure of Red LED on sapphire. Due to BCB bonding layer, these are suitable for Laser Lift Off (LLO) process. P/N electrodes have same face (lateral type structure).
By applying the thin BCB layer, the amount of BCB residue after LLO is minimized, and cleaning process after LLO can be minimized.

Size[mil]
Dominant wavelength[nm]
Up side(type)
0.7x1.4x0.3
625
P,N(lateral)
*Yellow chips are available.
*Current is one size, but resize is possible.
*We can also supply blue and green LEDs in addition to the red.