Encapsulation materials for semiconductor devices

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Epoxy molding compounds

Firstly-Underfill

Firstly-Underfill

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Product Name Feature Filler
Size
(Max.)
Viscosity Tg CTE1 CTE2 Modulus Substrate
Temp.
Cure
Condition
Storage
Condition
Shelfelife
Unit µm Pa・s ºC ppm/ºC ppm/ºC MPa ºC ºC/2h   Month
SMC-
377SA
Low-k/Low Warpage for FCBGA
10 30 100 35 95 8000 120 165 Under
-40ºC
8
SMC-
375XX
Pb Free for FCBGA
10 30 135 30 86 8000
SMC-
375XF4B
Narrow Gape Type
5 8 145 54 134 4200
SMC-
376X8
For Over Mold
10 60 140 27 67 12000
 

Secondary-underfil

Secondary-underfil

表を拡大する
Product Name Feature Filler
Size
(Max.)
Viscosity Gelation
Time
Tg CTE1 CTE2 Modulus Substrate
Temp.
Cure
Condition
Storage
Condition
Shelfelife
Unit µm Pa・s s/150ºC ºC ppm/ºC ppm/ºC MPa ºC ºC/2h   Month
SMC-
365SD-1
Good Capillarity
10 13 110 135 38 110 6500 120 150 Under
-40ºC
6
SMC-
375-1F
Good Adhesion
10 15 - 150 35 105 6000 165 8
SMC-
184A
for Re-Work
45 17 - 86(DMA) 47 155 3900 100 100ºC/0.5h

Potting

Potting

表を拡大する
Product Name Feature Viscosity Gelation
Time
Tg CTE1 CTE2 Modulus Substrate
Temp.
Cure
Condition
Storage
Condition
Shelfelife
Unit Pa・s s/150ºC ºC ppm/ºC ppm/ºC MPa ºC ºC/2h   Month
LMC-22
Flow Type
35 60 155 17 60 12000 80 150 Under
-20ºC
6

Glob-Top&COB

Glob-Top&COB

表を拡大する
Product Name Feature Viscosity Aspect
Ratio
Gelation
Time
Tg CTE1 CTE2 Modulus Substrate
Temp.
Cure
Condition
Storage
Condition
Shelfelife
Unit Pa・s /120ºC s/150ºC ºC ppm/ºC ppm/ºC MPa ºC ºC/2h   Month
SMC-868
Thixotrophic Type
70 0.3 65 150 14 51 13500 60~80 150 Under
-20ºC
6

Dam

Dam

表を拡大する
Product Name Feature Viscosity Aspect
Ratio
Gelation
Time
Tg CTE1 CTE2 Modulus Substrate
Temp.
Cure
Condition
Storage
Condition
Shelfelife
Unit Pa・s /120ºC s/150ºC ºC ppm/ºC ppm/ºC MPa ºC ºC/2h   Month
SMC
-5255
Good Shape Retention
700 0.7 70 140 25 95 8000 R.T. 150 Under
-20ºC
6