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Product list
Encapsulation materials for semiconductor devices
Epoxy molding compounds
Epoxy molding compounds
KMC series
Shin-Etsu is developing advanced packaging materials for encapsulating all types of semiconductor devices. This broad line of products offers low stress, very low warpage, and high thermal conductivity. Shin-Etsu has introduced a "green" halogen and antimony trioxide-free EMC that contributes to environmental conservation.
Liquid epoxy encapsulating materials
Liquid epoxy encapsulating materials
SMC series
Shin-Etsu liquid epoxy encapsulating materials for semiconductor devices performs excellent crack resistance due to silicone technology in stress reduction. Shin-Etsu can provide a variety of materials to meet various requirements of advanced packages.
Encapsulation materials for Optical devices
Shin-Etsu is a preeminent supplier of high purity silicones for high powder Light Emitting Diodes (LED). This broad line of products offers non-yellowing, excellent crack resistant and optical clear even after exposure to harsh conditions.
Junction coating resins
Junction coating resins
KJR series
Shin-Etsu offers a full line up of Junction coating resins. These ionic high purity electronic grade silicone resins are provided electrical protection of semiconductor elements, improved moisture-resistance, and reduced mechanical stress.
Die attach materials
Die attach materials
SFX series
Shin-Etsu offers a unique die attach material which is stencil printable material for flexible substrate. These epoxy materials are become B stage easily and stable for long time (25ºC/6 month) easy to control voids & flow. In addition, they show good warpage performance at various substrates.
