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Die attach materials
SGC series
Shin-Etsu is developing advanced silicone packaging materials for encapsulating high voltage electronics devices. This product offers high electrical resistivity, high thermal stability, mechanical stability and good release from mold die due to unique silicone technology.
| General properties | Feature | Spiral flow | Specific gravity | Flexural strength | Flexural modulus | Glass transition temp. | CTE | |
|---|---|---|---|---|---|---|---|---|
| CTE1 | CTE2 | |||||||
| Unit | inch | MPa | MPa | ºC | ppm/ºC | ppm/ºC | ||
| SGC-10 | Standard |
30 | 1.93 | 48 | 10,300 | 36 | 15 | 31 |
| SGC-12 | Good Strength |
28 | 1.93 | 56 | 10,300 | 33 | 14 | 29 |
