In terms of "CSP" and "SIP" orientation, progress has been made in making encapsulating materials for semiconductor devices more suited to demands for greater compactness. Shin-Etsu Chemical is using the high degree of technology which has cultivated through development of all kinds of silicone to develop epoxy molding compounds and liquid epoxy encapsulating materials using a new flame-resistant system. It is thus meeting the needs of the times.

Product Introduction

Epoxy molding compounds

These encapsulating materials provide low stress, low alpha-ray property and high thermal conductivity.They are also environmentfriendly.

-Features-

• Superior moisture resistance, electrical characteristics, and moldability. This material meets the high requirements for resin encapsulation of devices.
• By introducing a new, original flame-retardant system, this product is free from halogen and antimony trioxide.

-Applications-

• D-RAM and other LSI molding, full pack molding for power devices etc.

Liquid epoxy encapsulating materials

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices.

-Features-

• Excellent low stress, adhesive, and penetration property

-Applications-

• Under filling, COB potting, hermetic seal, and other uses for electrical or mechanical protection and highly reliable adhesion of semiconductor devices

Contact

Organic Electronics Materials Department
Electronics Materials Division
Phone : +81-3-3246-5231
Facsimile : +81-3-3246-5367